
Fabs & fabless
Control processes and improve yield
Total cost: a better balance
Use more data while reducing overall cost.
- Faster root cause analysis
- Better control of process windows
- Lower losses and improved yield
Smart3 connects your data, expertise and AI, from R&D to production.



Smart3 connects your data, from R&D to production.
Smart3 brings together the data involved in manufacturing innovative materials, organized into six broad categories.
Smart3 runs on your infrastructure: you retain control of your data and know-how, from R&D to production.
Multi-source data
Workflows · AI · Simulation
Measurements · Defects · Processes
Two industrial challenges, one platform to turn data into value.

Control processes and improve yield
Use more data while reducing overall cost.

Create more value around your equipment
Create your own IP on Smart3 and retain ownership of your developments.
Conceptual comparisons: gains depend on data, processes, integration scope and use cases.
Smart3 combines your data and analytical capabilities in one environment: metrology, inspection, simulation and optimization work together to understand your materials and processes.

Extract measurements and characterize structures using multi-source data.

Detect, segment and classify defects within your industrial context.

Connect experimental data, manufacturing parameters and physics-based models to inform decisions.
Describe your needs in natural language. With an LLM and documentation context supplied through RAG, create data readers and combine your plugins in Smart3.
Describe → Create → Compose
Watch the AFM & EBSD demo ↓Simulation becomes more useful when tested against reality. Smart3 connects simulation tools with characterization data to compare results, refine models and guide the next experiments.
Illustrated example: plasma etching — from simulation to SEM/TEM cross-sections and measurements in Smart3. The same loop also applies to other processes, substrates, components and materials.


Define objectives, factors and experimental conditions.
Run experiments using the selected recipes and parameters.
Measure structures, materials and defects using SEM, TEM, AFM and other sources.
Connect measurements with parameters, compare performance and investigate discrepancies.
Compare models with reality, explore scenarios and guide the next DOE.
Back to DOE: each cycle informs the models and helps select the next experiments. Smart3 connects data and tools throughout this loop.
Connect measurements with parameters to identify performance drivers.
Focus experiments and connect simulation with experimental data.
Automate analysis and make better use of data to guide decisions.
Train your teams and explore your data.
Assess a focused use case and its feasibility.
Develop and validate your application.
Integrate and deploy in production.
Expand applications and continuously improve.
Start with a concrete application, then expand Smart3 as your needs evolve. Your proposal clearly separates licenses and services, with scope and costs agreed together.
Based on the number of licenses and how they are used: R&D teams, production sites or integration into your equipment.
Training, support and custom development: we tailor our involvement to your resources and your goals for autonomy.
From your first project to broader deployment, you have visibility into the costs of each stage.

Your local partner in Japan to discuss Smart3 and your applications.
Visit the KESCO website ↗Website currently under maintenance.Your local distributor in South Korea to discuss Smart3 and your applications.
Visit the Woowon website ↗From process development to production monitoring: make use of metrology and inspection data.
Analyze structures, interconnects and defects. Connect characterization data to manufacturing parameters.
Characterize microLEDs and optical structures. Bring measurements and simulation together.
Build analysis workflows to understand the relationships between structure, properties and process.

Connect data, analyze results and guide process decisions.

Integrate your algorithms and enhance your tools’ capabilities.
One platform. Two integration paths.
Fabs, fabless companies and equipment suppliers: build your domain applications on Smart3, an open, customizable and unified software platform.
Build on ten years of core technology development to integrate your data, algorithms and workflows while retaining your know-how and differentiation.
Harmonize tools and methods across teams, instruments and sites.
Concentrate on data science, processes and the applications that set you apart.
Limit cross-cutting development and proprietary platform maintenance with a common software foundation maintained and enhanced by Pollen.
Whether deployed in a fab or integrated into equipment, Smart3 runs on your infrastructure. Data confidentiality remains central to every deployment.
Savings extend beyond time: shared platform development, maintenance, testing and software infrastructure help reduce your total cost over time.
Founded in Grenoble in 2014 and based in Moirans since 2015, Pollen grew out of fifteen years of research by its founder, Johann Foucher, at CNRS and CEA in plasma physics for semiconductor etching and advanced metrology.
One conviction guides Smart3: understanding processes requires connecting data and making analysis customizable. Our open software platform combines experimental data, domain expertise and simulation within a holistic view of processes.
From 2015 to 2024, ten years of development built the Smart3 core and a multidisciplinary team spanning software, AI, signal processing, semiconductors, materials characterization, physics and chemistry.
Today, this collective expertise translates into practical applications for industrial customers and equipment suppliers in the United States, Europe and Asia, from R&D to production.

Founder & CEO
LinkedIn ↗
Team Leader Application & Support
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Team Leader Data Science
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Team Leader Software Development
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YouTube ↗
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On 14–15 October 2026 at Alpexpo, Pollen showcased its careers, Smart3 and recruitment and internship opportunities at OPCO Atlas booth N3.
View on LinkedIn ↗
Pollen at the 3rd National Packaging Days, held on 13–14 October 2026 at CEA-Leti in Grenoble. Richard Fontanges presented how Smart3 connects images, measurements, process data and defects to guide engineering decisions.
View on LinkedIn ↗
Pollen · Booth B00Pollen exhibited at MicroLED Connect and AR/VR Connect on 16–17 September 2026 in Eindhoven, the Netherlands, at booth B00.
View on LinkedIn ↗Event website · image source ↗
A look back at the CICERIF working session at Valeo, focused in particular on FALAISE — Failure AI for Sustainable Electronics. A collective initiative of the French Electronics Federation around innovation and sustainable electronics.
View the FdEF post ↗
A day in the mountains to celebrate a new milestone for Pollen and thank the team, customers and partners. Hiking, lunch at Altitude 2000 and time together celebrating what makes the journey possible: trust, passion and teamwork.
View on LinkedIn ↗
Presented by Julien Baderot in Grenoble, collaborative Pollen–STMicroelectronics research on FDSOI gates combines AI-based automated TEM metrology, digital twins and multi-objective plasma etching optimization to accelerate the identification of process windows.
View on LinkedIn ↗Explore six selected publications and an outside perspective on Pollen. Metrology, defect analysis, open platforms and process optimization: research rooted in industrial applications.
Lauro Rizzatti explores the development of Smart3 and its role in connecting data, equipment and engineering expertise across semiconductors and advanced materials.
Read on SemiWiki ↗Infinitesima
Combine high-speed AFM scans into large-area maps and analyze them in Smart3, in collaboration with Infinitesima.
View publication ↗Advancements and challenges in large-scale atomic force microscopy image stitching for semiconductor devices
Combine measurements and defect detection, from patterns to wafers, in an open platform configured by the engineer.
View publication ↗Metrospection: holistic AI-driven process control software platform dedicated to metrology and defectivity for patterning process at die and wafer levels
Connect data cleaning, modeling and process optimization while retaining the ability to integrate proprietary algorithms.
View publication ↗Open collaborative AI platform to support process optimization for semiconductor industry with digital twin
STMicroelectronics
A no-code AI layer to help engineers connect simulation with process data and explore optimization trade-offs, with STMicroelectronics.
View reference ↗Augmented Engineer: A No-Code AI Application Layer for Bridging the Gap Between Plasma Simulation and Real-World Processing
Meta
Measure slanted gratings in TEM and structures in CD-SEM with workflows that evolve alongside Meta’s process development.
View publication ↗Scalable and adaptable structural metrology for AR/VR device images based on deep learning
The foundations of Pollen’s AI metrology: annotation, detection, segmentation and measurements from user-provided examples.
View publication ↗Application of deep-learning based techniques for automatic metrology on scanning and transmission electron microscopy images
Tell us about your data, application and objectives. Together, we will define a practical first step.